SINGAPORE--24 APRIL 2013, UNITED STATES--(Marketwired - Apr 24, 2013) - STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, today announced the appointment of Mr. James A. Norling to succeed Mr. Charles R. Wofford as Chairman of the Board of Directors with immediate effect. He was appointed to the Board of Directors at the Company's Annual General Meeting held on 24 April 2013. Mr. Wofford will retire from over 15 years of service on STATS ChipPAC's Board of Directors, including 11 years as Chairman of the Board.

Mr. Norling is presently the Executive Chairman of GLOBALFOUNDRIES Inc. and a Director of Harley-Davidson, Inc. A well respected electronics industry veteran, Mr. Norling served a distinguished 35-year career with Motorola Inc. from 1965 to 2000, where he was the president of the Personal Communications Sector. He was the former Chairman of Chartered Semiconductor Manufacturing Ltd ("Chartered"), from 2002 until the company was acquired by Advanced Technology Investment Corporation in 2009. Mr. Norling also served as interim President and Chief Executive Officer of Chartered during 2002.

Mr. Wofford remarked, "It is my honor and privilege to have lead STATS ChipPAC through the past 11 years of growth to be one of the largest semiconductor assembly and test companies in the world. This would not have been possible without the leadership and guidance of my fellow Board members. Jim's seasoned industry experience and wealth of perspectives will contribute greatly to STATS ChipPAC's continued success as a leading semiconductor assembly and test company."

Mr. Norling said, "I am delighted to join STATS ChipPAC as the Chairman of the Board and am excited to build on the firm foundations and momentum of the Company. The Board expresses its deep appreciation and gratitude to Charles for his leadership and exceptional contributions as the Chairman of STATS ChipPAC."

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. (SGX-ST Code: S24) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is listed on the SGX-ST. Further information is available at [ www.statschippac.com ]. Information contained in this website does not constitute a part of this release.